Micromachining

ホーム Micromachining

Micromachining

Overview

Micromachinig is our keyword.
Focusing on laser microfabrication (micro-welding, micro-soldering, micro-drilling, ablation), we can provide a wide range of support, from single product prototyping to mass production, using optimal processing methods that make full use of laser micromachinig, electrical discharge machining, cutting, etc., according to customer specifications and applications.




 Example of fabriated samples




Feature

  • Welding、overlaying
  • Micro-holes, pin-hole
  • Deep driiled hole, stop hole, high-aspect ratio hole
  • Long hole, round hole, groove, high-aspect ratio slit
  • Precise cutting

Processing method

  • Short pulse / ultra short pulse laser
  • CW／Q-CW laser
  • Chemical etching
  • EDM
  • Mechanical machining with dedicated tools
* We are constantly researching and developing microfabrication processes that are considered difficult with existing processes, such as microshapes and special materials.

Measurement / Observation

We will adopt the most appropriate measurement/observation method considering various factors such as light reflection on the material surface and the influence of magnetism, etc., when the processing level is minute to the micrometer order.
  • Digital microscope
  • Laser microscope
  • Scanning electron microscope（SEM）
  • SStereomicroscope
  • High speed infrared camera

Metal processing

Mocro laser welding


High precision laser welding Micro welding process High precise laser welding
Material : cupper
Method : key hole welding
High demand cupper welding		 Material : stainless steel
Method : key hole welding
Rigid precise weldin with laser		 Material : aluminum
High precision laser welding with beat width 0.2mm

Laser micro-welding Micro butt welding High precision laser welding
Material：Copper (Cu) and Nickel (Ni)
Method：Laser micro welding
Fine micro-welding is also possible		 Material：Copper foil and nickel foil
Method：Butt welding
Precise welding of materials butt-welded together		 Material：Copper foil on Nickel foil
Secure welding down to the nickel foil on the underside


Slit processing


High precision slitting Micro slitting Micro slit processing
Groove observation：　width0.04mm×depth0.9mm Groove observation：　Groove : Width0.04mm×depth0.9mm Kerf：< 100µｍ


Microhole processing


Microhole High precision microhole Microhole processing
Material：Stainless steel
Thickness：100μm
Hole diameter：Φ10μm（±1μｍ）		 Material：Tungsten（W)
Thickness：50μm
Hole diameter：Φ35μm（±1μｍ）		 3D imaging of microhole in tungsten

Super long cavity processing Super long cavity processing Super long cavity processing
Material：Stainless steel
Depth：150mm
Hole diameter：Φ600μm		 Long hole processing, almost as long as a mechanical pencil With observing the edge, φ0.6mm hole can be found.

High precision micro hole Micro hole Micro hole processing
Material：Nickel with gold plating
Hole diameter：Φ300μm
Precision machining to gold with high reflectance		 Material：Copper foil (Cu)
Thickness：100μm
Hole diameter：Φ40μm
Fine holes with minimal thermal effects		 Material：Copper foil (Cu)
Thickness：100μm
Hole diameter：Square hole 300μm
Fine holes with minimal thermal effects

High precision micro hole High-aspect microhole machining Micro hole
Material ：Copper foil（Cu）t0.1mm
Hole diameter：Φ150μm
Precision processing is possible even for copper with high reflectance.		 Material：Aluminum（A5052）
Hole diameter：φ65μm
Depth：> 150μm
High-aspect microhole		 Mateial：Stainless steel (SUS430)
Tapered microhole

Precise drilling Extreme precise hole processing Precision hole drilling on pipe
Material : tantalum t3mm
Hole diameter : Φ100μm		 Material : stainless steel
Hole diameter : φ37μm
Circularity：1μm		 Object : stainless pipe
Hole diameter : Φ100±1μm

Micro mesh Tantalum through-hole processing Molybdenum counterbore processing
Material：Stainless steel
Hole diameter:0.05mm
Number of holes：6000
Biotechnology		 Material：Tantalum
opening:12µm
Thickness：0.1mm
Research and development, Biotechnology		 Material：Molybdenum
opening:9µm
Counterbore depth：35µm
Research and development, Semiconductor

Blind hole Implant device Filter
Material：Stainless steel
Hole diameter:0.1mm
Depth：0.04±0.005mm
Biotechnology		 Material：Platinum-iridium alloy
Opening:Φ 0.09±0.01mm
Thickness：0.2 ~ 0.5mm
Bio-medical		 Material：Stainless steel(15-5 PH)
Thickness：0.5mm
Hole diameter：0.15±0.01mm
Bio-medical, Basic research


Filter
Material：Stainless steel(15-5 PH)
Thickness：0.5mm
Hole diameter：0.1±0.01mm
Aerospace, Petrochemical industry

Precision nozzle High aspect long hole drilling Apex processing
Material: Stainless steel
Hole size:Φ80μm
Precise nozzle		 Material: Stainless steel
Hole sise: φ350μm
High aspect ratio long hole and precise hole drilling		 Material : Ni-Ti
Apex of narrow needle

Ultra precise hole
Material：Nickel
Thickness：20µm
Hole diameter：Φ10μm
Ultra small hole


Micro groove

Micro groove processing High density micro groove Precise micro groove
Material ：SPCC
t0.2mm
width 100µm
Micro groove		 Mateial：SPCC
High density micro groove		 Material：Aluminum（A5052）
Very narrow groove: width 30µm

Micro slit ontungsten High accurate slit Microgroove on steel
Slit on tungsten Material：tungsten<
Width：80μm
Length：2mm		 Material：SUS304
Micro groove

Micro slit processing Precision comb electrode Precise slit
Irregular shape slit Material : stainless
Accuracy : 1μm
Good straightness slit		 Slit width : 5μm
High accurate slit processing

Grid cutting Molybdenum mesh cutting Slit processing
Material：Stainless steel
Rib width:10µm
Thickness：0.015mm
Biotechnology, Basic research		 Material：Molybdenum
Cutting precision：±0.01mm
Thickness：0.1mm
Heat-affected zone:<5µm
Biotechnology		 Material：Metal
Groove width：0.05mm
Thickness：0.3mm
Bio-medical

Precision slit processing Thin-walled metal precision cutting Implant device
Material：Stainless steel
Slit width：3µm
Thickness：0.1mm
Cutting precision：±0.001mm
Biotechnology, Research and development		 Material：Platinum-iridium alloy
Tube diameter：Φ0.3mm
Thickness：0.02mm
Bio-medical		 Material：Stainless steel
Tube diameter：Φ3mm
Groove width：0.3±0.01mm
Bio-medical

Ultra-precision cutting Gear precision cutting Ultra-precision cutting
Material：Molybdenum
Thickness：0.2mm
Line width：0.1±0.003mm
Precision：±0.005mm
Basic research, Filter		 Material：Stainless steel
Thickness：0.2mm
Cutting precision：±0.02mm
Basic research, Watchmaking		 Material：Stainless steel
Thickness：0.2mm
Precision：±0.01mm
Basic research

Etching

Roller etching Roller bearing groove etching Surface microstructure etching
Material：Metal
Depth：60～80µm
Interval：60～80µm
Tools, Molds		 Material：Stainless steel
Depth：43µm
precision：0.001mm
Tools, Aerospace		 Material：Platinum-iridium alloy
Depth：0.007mm
Width：0.005mm
Semiconductor microelectronics


Stainless cylindrical etching Cylinder etching
Material：Stainless steel
Depth：40±0.001µm
width：35±0.001µm
Semiconductor microelectronics		 Material：Gold
Depth：0.07mm
Width：0.5mm
Semiconductor microelectronics


Structural processing

Microstructure processing on puncture needle surface
Material：Stainless steel
Depth：0.04±0.005mm
Processing speed：2hole/s
Biomedical

Glass processing

Micro hole processing

High quality micro hole processing High preciion micro hole Micro holes in curved glass
 
Material：Glass
Thickness：0.3mm
Hole diameter：Φ120μm		 Hole diameter : Φ0.12±0.005mm
Hole distance : 0.25±0.005mm
Number of holes : 200
Application : a part of teter		 Material：Curved glass
Thickness：1mm
Hole diameter：Φ100μm


Slit on glass Micro slit High accurate glass processing
 
Material：glass
High acurate micromachining		 Width 80µｍ, length 2mm : micro slit Material :glass
Processing of glass without chipping


SiN Square hole Taper controlled 3D hole High precision glass blind hole
   
Material：SiN
0.05mm□ Thru hole
Corner R：< 0.005mm
High precision micromachining		 Material：ceramics
Depth：0.3mm
Surface roughness : Ra<0.4µm
3D taper controlled hole		 Material：quartz glass
Depth：20µｍ
Blind hole


Groove

Precision glass processing Glass groove Precise bild groove
   
Material：glass
Depth : 0.04±0.005mm
Glass micro etching		 Material：glass
Depth：0.5mm
Width：1.5mm
Bio-technology application		 Material：fused silica
Accuracy：±0.02mm
Semiconductor device


Glass blind holes Glass deep drilled hole Precise glass etching
   
Material：quartz glass
Depth：0.4mm
Accuracy：0.001mm
Bio-technology application		 Material：quartz glass
Depth：１.5mm thru hole
Diameter：0.2±0.002mm
Bio-technology application		 Material：glass
Depth：1µｍ
Width：3µｍ
Semiconductor application

Polymer processing

Hole drilling

PI precise hole drilling High precision micro hole drilling Untra precise cutting
   
Material：Polyimide
Depth:0.2mm
Diameter：φ0.2mm
Bio-medical application		 Material：Polymer
Wall thickness：0.3mm
Hole diameter：φ0.6mm
Biotechnology application		 Material：cabon fiber
Film thickness：0.15mm
Slit width：0.1mm
Semiconductor device


PDMS micro hole array PI micro hole array High precision PDMS etching
   
Material：PDMS
Diameter：10µm
Thickness：0.05mm
Biotechnology application		 Material：Polyimide
Diameter：8µm thru hole
Thickness：0.05mm
Bio-medical application		 Material：PDMS
Depth：0.05mm
Hole diameter：10µｍ
Semiconductor device
Pagetop